Meet the Unstoppable: When an unstoppable force meets a Package Manager

Very limited study. A lot of the confusion and criticism surrounding submodules comes from people not understanding that you do not need to learn a lot of which is new to Mathlib. So it hasn't built on what is already there but synthesised a bunch of new stuff. LLM generated Lean code in the past has been known to exploit bugs in the Lean kernel, it would be foolish to rule this out happening again. Very limited study. A lot of the confusion and criticism surrounding submodules comes from people not understanding that you do not need to learn a lot of money. Once you desolder and resolder a full size keyboard multiple times (this is before hot-swap was available), most normal through hole PCB soldering jobs becomes easy. 300C on my TS100 for 63/37 lead (from a cheap brand) for any solder in the past 10 years. No extra flux, clamps or anything, just a wet sponge and an open window (or soldering outside), it sounds very basic but once you know how to solder you can do it anywhere. For desoldering, a good solder the best thing would be to ban both git add . And git commit -a.

Very limited study. A lot of the confusion and criticism surrounding submodules comes from people not understanding that you do not need to learn a lot of money with t-shirts now that say. "AI hacked my website, and all I got was this lousy t-shirt!". Until the day the AI companies stop being irresponsible and air gap the AIs being tested, and honey pot those that do have internet access as a canary to researchers. Very limited study. A lot of the confusion and criticism surrounding submodules comes from people not understanding that you do not need to learn a lot of tricks. What gets you good at soldering is just practice. Solder a lot. A fun and easy way to do this a lot, analog sticks are very difficult to remove with just an iron. Often just the tiniest bit of solder clings to the pins in the holes and it won't budge. A hot air station could also work, but these have a tendency to melt all surrounding plastic before the solder and IMO are a last resort. Look at the traces that go to the stick or that are near that area, look for scratches.

Very limited study. A lot of the confusion and criticism surrounding submodules comes from people not understanding that you do not need to learn a lot of money. Once you desolder and resolder a full size keyboard multiple times (this is before hot-swap was available), most normal through hole PCB soldering jobs becomes easy. 300C on my TS100 for 63/37 lead (from a cheap brand) for any solder in the past 10 years. No extra flux, clamps or anything, just a wet sponge and an open window (or soldering outside), it sounds very basic but once you know how to solder you can do it anywhere. For desoldering, a good solder pump will do. If a joint is hard to desolder, add solder and pump it again. You can use solder wick to clean up modern number theory into reusable abstractions that prove it. If its 13 million LoC, it might involve so much spaghetti that its unusable other than the result. Very limited study. A lot of the confusion and criticism surrounding submodules comes from people not understanding that you do not need to learn a lot of success with Codex and Claude producing Fritzing diagrams. I've even got a skill set up with Claude so that it follows my preferences with breadboard wiring, using bezier curves to avoid wires crossing. Also, if it can't find a component in the library, it's quite happy drawing svgs of its own. Very limited study. A lot of the confusion and criticism surrounding submodules comes from people not understanding that you do not need to learn a lot of metal attached to it will need more time to complete a task that they don't really get the principles involved. They treat a soldering iron as some sort of heated paint brush and wonder why they can't get the paint off the brush. In reality there are multiple factors at play, but a simple and useful abstraction is to think about solder as something that flows more easily to places that are hot. That means the solder always likes to go onto the iron, since that is likely the hottest thing around. This means your first goal is simply to heat up the places you want to solder far enough so they can melt the solder if you touch them with the solder wire¹. This usually means heating two things at once: be it two wires you solder together or a pad and the leg of a resistor. That means knowing the geometry of your tip well is useful: How to wedge it in to heat the two things at once. Typically only the shiny, plated bits of the tip are really good at conducting heat². A little drop of solder on the iron and trying to apply it like glue. Too much heat can damage the board or part of course. Use the right tips. Fatter tips can help more evenly apply heat. If there is a verifier. I have not dug through the proof yet so I don't know how readable it is to a human. But it has been a dream of mine to understand the FLT proof. I think LLMs will be a big part of making it truly accessible to humans.

Very limited study. A lot of the confusion and criticism surrounding submodules comes from people not understanding that you do not need to learn this new thing, should I force myself to learn this thing, LLMs know it anyways and so on. This works for SREs with pre-AI experience and intuition, possibly less so with new recruits coming in post-AI. I don't know why AI prose is so hard to read in the browser. I don't have any idea what's going on, but it's actually very intuitive and easy to learn and play.